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Friday, 30 July 2010
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Transcend 2GB DDR2 800 Mhz SoDimm
JEDEC Standard. The Module is DDR2-800 CL5 Small Outline Memory module. The Module density is 2GB, it consists DDR2 800MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 200-pin edge connector sockets.
DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
The Module is DDR2-667 CL5 Small Outline Memory module. The Module density from 256MB to 2GB, it consists DDR2 667MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 200-pin edge connector sockets.
| DDR2 Speed Grade So DIMM |
667Mbps 200-pin |
| Memory Organization CAS latency |
x8 , x16 FBGA DRAM chip 5-5-5 |
| DDR2 DRAM interface Bandwidth |
SSTL_18 5300MB/s |
| VDD voltage | 1.8+-0.1V |
| VDDQ voltage | +1.8V (+/- .1v) |
| Power | 1.32 W (operating) |
| Application | Notebook |
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