Status | Launched |
Launch Date | Q3'14 |
Processor Number | i3-4160 |
Intel® Smart Cache | 3 MB |
DMI2 | 5 GT/s |
# of QPI Links | 0 |
Instruction Set | 64-bit |
Instruction Set Extensions | SSE4.1/4.2, AVX 2.0 |
Embedded Options Available | No |
Lithography | 22 nm |
Scalability | 1S Only |
Thermal Solution Specification | PCG 2013C |
Conflict Free | Yes |
Datasheet | Link |
# of Threads | 4 |
Processor Base Frequency | 3.6 GHz |
TDP | 54 W |
Memory Types | DDR3-1333/1600 |
Max # of Memory Channels | 2 |
Max Memory Bandwidth | 25.6 GB/s |
ECC Memory Supported ‡ | Yes |
Graphics Base Frequency | 350 MHz |
Graphics Max Dynamic Frequency | 1.15 GHz |
Graphics Video Max Memory | 1.7 GB |
Intel® Quick Sync Video | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Wireless Display | Yes |
Intel® Clear Video HD Technology | Yes |
# of Displays Supported ‡ | 3 |
PCI Express Configurations ‡ | Up to 1x16, 2x8, 1x8/2x4 |
Max # of PCI Express Lanes | 16 |
TCASE | 66.4°C |
Package Size | 37.5mm x 37.5mm |
Graphics and IMC Lithography | 22nm |
Sockets Supported | FCLGA1150 |
Low Halogen Options Available | See MDDS |
Intel® Turbo Boost Technology ‡ | No |
Intel® Hyper-Threading Technology ‡ | Yes |
Intel® Virtualization Technology for Directed
I/O (VT-d) ‡ | No |
Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes |
Intel® TSX-NI | No |
Intel® 64 ‡ | Yes |
Idle States | Yes |
Enhanced Intel SpeedStep® Technology | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Stable Image Platform Program (SIPP) | No |
AES New Instructions | Yes |
Secure Key | Yes |
